BOLT10

Pictures: 
Overview: 

The Bolt10 System on Module (SoM) combines Xilinx's Zynq-7020 All Programmable SoC device with fast DDR3 SDRAM, NAND flash, quad SPI flash to form a flexible and powerful embedded processing system. Zynq-7020 integrates a feature-rich dual-core ARM Cortex-A9 MPCore based Processing System (PS) and Xilinx Programmable Logic (PL) in a single device.

Bolt10 provides ultimate user I/O flexibility by routing the major PS peripheral I/O (MIO[53:16]) to the base board interface connectors allowing flexible user peripheral I/O assignment. The PS MIO signals are electrically designed to handle signal speeds of >1Gbps. In addition, 196 Programmable Logic (PL) pins are made available to the user via the base-board interface connectors. The PL I/O signals are routed to the connectors as a combination of 70-differential and 56-single-ended signals.

Hirose FX8C high-speed (3.125Gbps) stacking connectors are used to provide users with high-speed LVDS signal interface capability.

All required core voltages are generated on-board from a single 5V supply input. The IO voltage levels are user selectable and provided by the baseboard.

The small credit card size (2.1” x 3.2”) form factor allows space-saving hardware designs. The PCB provides 4 mounting holes for ruggedized applications.

Highlights: 
  • Built around Xilinx's Zynq-7020-CLG484 All Programmable SoC
  • Combines the flexibility of a the ARM Cortex A9 with over 100K FPGA Flip Flops for High Performance Data Processing
  • Supports both digital IOs and analog differential inputs
  • Supports high-speed 600-950Mbps LVDS signaling
  • Available in commercial and industrial temperature range
  • Interfaces include Gigabit Ethernet, USB 2.0 OTG, I2C, SPI, CAN, DVI, and SDIO
  • Uboot and Linux ported to the Bolt10
  • Onboard Diagnostics including DDR3, SPI, NAND FLASH and Serial Port Tests
Benefits: 
  • A flexible and powerful embedded processing and FPGA system in a small (2.1” x 3.2”) form factor
  • Simple, low cost and yet rugged assembly
  • Simple and low-cost integration
  • Fast software boot with image locations in QSPI, NAND Flash, and/or SDIO memory
  • 1600MT/s High-bandwidth program and data DDR3 memory
  • Low power consumption due to the Zynq7020 power and high-efficiency DC/DC converters
Features: 
  • Xilinx Zynq-7020 AP SoC in the CLG484 package (XC7Z020)
    • ARM® dual-core Cortex™-A9 and Xilinx Artix™-7 28 nm FPGA fabric
  • Small credit card size form factor (2.1” x 3.2”)
  • 196 user I/Os
    • ARM peripherals (Gigabit Ethernet, USB2.0, SPI, SDIO, CAN, I2C, UART)
    • FPGA I/Os (56 single-ended, 70 differential)
  •  1 GB 800 Mhz DDR3 SDRAM
  • 2 GB NAND flash
  • 128 MB QSPI flash
  • Single 5.0 V supply voltage

4 Hirose FX8C stacking connectors supporting up to 3.125Gbps signal rates