Schematic Design Technologies Include:
- DDR2, QDR Memory
- PCIe Gen2
- Ethernet 10G, 1G, 100M, 10M
- LVDS
- USB1.1/USB2.0
- CAN
- Analog-Digital Converters, Digital-Analog Converters
PCB Layout Technologies Include:
- 30 Ghz routing techniques
- Differential pairs
- Controlled Impedance
- RF Isolation
- Stacked and Microvias
- Low Cost PCB material FR4
- High Speed Material: Nelco 4000, Megtron 6, and Rogers 4350B
SIgnal Integrity Technologies Include:
- 30+ Ghz routing techniques
- Differential pairs
- Controlled Impedance
- Noise Isolation
- High Speed Material: Nelco 4000, Megtron 6, and Rogers 4350B
FPGA Design Technologies Include:
- In Chip Embedded Processors and Microcontrollers
- High Speed Interfaces
- 5Ghz SERDES Board-Board Interface
- DDR3, QDR2+ Memory Interfaces
- High Speed ADC/DAC Interfaces
- 400Mhz LVDS interfaces
- In-Chip Diagnostics
- IP Packet Inspection/Processing
- DSP Algorithms: Filters, FFTs
Test Technologies Include:
- DDR2, QDR Memory
- PCIe Gen2
- Ethernet 10G, 1G, 100M, 10M, PHY
- SERDES, LVDS
- USB1.1/USB2.0
- CAN
