Technologies

Schematic Design Technologies Include:

  • DDR2, QDR Memory
  • PCIe Gen2
  • Ethernet 10G, 1G, 100M, 10M
  • LVDS
  • USB1.1/USB2.0
  • CAN
  • Analog-Digital Converters, Digital-Analog Converters

 

PCB Layout Technologies Include:

  • 30 Ghz routing techniques
  • Differential pairs
  • Controlled Impedance
  • RF Isolation
  • Stacked and Microvias
  • Low Cost PCB material FR4
  • High Speed Material:  Nelco 4000, Megtron 6, and Rogers 4350B

 

SIgnal Integrity Technologies Include:

  • 30+ Ghz routing techniques
  • Differential pairs
  • Controlled Impedance
  • Noise Isolation
  • High Speed Material:  Nelco 4000, Megtron 6, and Rogers 4350B

 

FPGA Design Technologies Include:

  • In Chip Embedded Processors and Microcontrollers
  • High Speed Interfaces
  • 5Ghz SERDES Board-Board Interface
  • DDR3, QDR2+ Memory Interfaces
  • High Speed ADC/DAC Interfaces
  • 400Mhz LVDS interfaces
  • In-Chip Diagnostics
  • IP Packet Inspection/Processing
  • DSP Algorithms:  Filters, FFTs

 

Test Technologies Include:

  • DDR2, QDR Memory
  • PCIe Gen2
  • Ethernet 10G, 1G, 100M, 10M, PHY
  • SERDES, LVDS
  • USB1.1/USB2.0
  • CAN